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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
HENKEL AG & CO KGAA	40589 DÜSSELDORF

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bai, Jie	Aliso Viejo, US	123	808
Horikiri, Masashi	Kanagawa, JP	5	9

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Mar 18, 2026

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 18, 2014	US,20140264822,A1   US20140264822A1	FIRST PUBLISHED PATENT APPLICATION
September 09, 2014	US,8829694,B1   US8829694B1	GRANTED PATENT AS FIRST PUBLICATION

Full Text

US Patent Application No: 2014/0264,822

THERMOSETTING RESIN COMPOSITIONS WITH LOW COEFFICIENT OF THERMAL EXPANSION

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