Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
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United States of America Patent
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Dec 13, 2016
Grant Date -
Sep 18, 2014
app pub date -
Mar 13, 2013
filing date -
Mar 13, 2013
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Abstract
Bumpless build-up layer (BBUL) semiconductor packages with ultra-thin dielectric layers are described. For example, an apparatus includes a semiconductor die including an integrated circuit having a plurality of external conductive bumps. A semiconductor package houses the semiconductor die. The semiconductor package includes a dielectric layer disposed above the plurality of external conductive bumps. A conductive via is disposed in the dielectric layer and coupled to one of the plurality of conductive bumps. A conductive line is disposed on the dielectric layer and coupled to the conductive via.
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