WAFER-TO-WAFER FUSION BONDING CHUCK
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 14, 2013
filing date -
Mar 14, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A chuck face of a wafer bonding chuck that includes a flat central zone and an outer annular zone contiguous to the central zone, the outer annular zone being lower than the flat central zone such that an annular edge portion of a wafer that is mounted to the chuck face has a convex profile with respect to the chuck face of the bonding chuck. The outer annular zone may move along an axis that is perpendicular to the central zone. The chuck face may include a plurality of contiguous zones, with at least one of the zones moveable with respect to another of the zones.
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Cited Art Landscape
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