Screening methodology to eliminate wire sweep in bond and assembly module packaging

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United States of America Patent

PATENT NO 9470740
APP PUB NO 20140266242A1
SERIAL NO

13834039

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Abstract

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Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ayotte, Stephen Peter Essex Junction, US 6 16
Gonzales, Michael Russell Uy Quezon Province, PH 5 1
Lam, Mark Tiam Weng Singapore, SG 2 0

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