Electronic component and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 15, 2015
Grant Date -
Sep 18, 2014
app pub date -
Mar 6, 2014
filing date -
Mar 14, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.
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