Liquid ejecting head, liquid ejecting apparatus, piezoelectric element, and manufacturing method thereof
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United States of America Patent
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Sep 29, 2015
Grant Date -
Sep 18, 2014
app pub date -
Feb 12, 2014
filing date -
Mar 13, 2013
priority date (Note) -
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Abstract
There is provided a liquid ejecting head including: a flow path formation substrate on which a pressure generation chamber communicating with nozzle openings for discharging liquid is provided; and a piezoelectric element which is provided on the flow path formation substrate and includes a piezoelectric layer, an electrode, and a wiring layer connected to the electrode, in which the wiring layer includes an adhesion layer which is provided on the electrode side and contains at least titanium and tungsten, and a conductive layer containing copper which is provided on a side of the adhesion layer opposite the electrode.
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