In-package fly-by signaling

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United States of America Patent

PATENT NO 9241420
APP PUB NO 20140268537A1
SERIAL NO

14275098

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Abstract

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In-package fly-by signaling can be provided in a multi-chip microelectronic package having address lines on a package substrate configured to carry address information to a first connection region on the substrate having a first delay from terminals of the package, and the address lines being configured to carry the address information beyond the first connection region to at least to a second connection region having a second delay from the terminals that is greater than the first delay. Address inputs of a first microelectronic element, e.g., semiconductor chip, can be coupled with each of the address lines at the first connection region, and address inputs of a second microelectronic element can be coupled with each of the address lines at the second connection region.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Yong San Jose, US 426 3480
Crisp, Richard Dewitt Hornitos, US 113 2737
Haba, Belgacem Saratoga, US 716 20639
Zohni, Wael San Jose, US 152 2935

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