Device for cooling an electronic component in a data center

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United States of America Patent

PATENT NO 9326430
APP PUB NO 20140268549A1
SERIAL NO

14350066

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.

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Patent Owner(s)

  • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Neumann, Matt Roseville, US 6 18
Rau, Timothy Michael Meridian, US 3 31

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