Coreless substrate with passive device pads
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United States of America Patent
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Nov 22, 2016
Grant Date -
Sep 18, 2014
app pub date -
Mar 13, 2013
filing date -
Mar 13, 2013
priority date (Note) -
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Abstract
Embodiments of the present disclosure are directed towards coreless substrates with passive device pads, as well as methods for forming coreless substrates with passive device pads and package assemblies and systems incorporating such coreless substrates. A coreless substrate may comprise a plurality of build-up layers, such as bumpless build-up layers (BBUL). In various embodiments, electrical routing features and passive device pads may be disposed on an outer surface of the substrate. In various embodiments, the passive device pads may be coupled with a conductive element disposed on or within the build-up layers. In various embodiments, an electrical path may be defined in the plurality of build-up layers to route electrical power between the passive device pads and a die coupled to the coreless substrate.
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