RECLOSABLE PACKAGES AND METHODS OF MANUFACTURING
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United States of America Patent
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N/A
Issued Date -
Sep 18, 2014
app pub date -
Mar 14, 2013
filing date -
Mar 14, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A reclosable package has front and back panels each have a top end and a maximum height such that the maximum height of the back panel is greater than the maximum height of the front panel, resulting in an exposed segment of the back panel uncovered by the front panel. A closure flap including a first adhesive layer and a second adhesive layer and being non-removably attached to the exposed segment of the back panel via the first adhesive layer and removably attached to a portion of the front panel via the second adhesive layer. After opening to access an interior of the package, the second adhesive layer can be used to reattach the closure flap to the front panel. A method of manufacturing the package is also provided.
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