METHOD FOR FABRICATING NEGATIVE PHOTORESIST ETCHED PITS AND TRENCHES AS CONTROLLED OPTICAL PATH AND A DEVICE FABRICATED THEREBY
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Mar 15, 2013
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
This invention overcomes the challenge of finding and applying a suitable underfill material in an optical engine by filling the gap between a substrate-mounted optical device (such as a VCSEL/PIN) and a fiber transmitting light to/receiving light from the optical device. The air gap is filled with SU-8 Negative Photoresist (or any material with the same functional and optical characteristics) via spin coating during the wafer processing portion of the engine assembly. The SU-8 material can be used to fill only the area around a 45 degree mirror (i.e., the pit) or can be deployed both in the pit and part of the fiber trench.
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