MOLDABLE CAPSULE AND METHOD OF MANUFACTURE

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United States of America Patent

APP PUB NO 20140272417A1
SERIAL NO

13842541

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method to form moldable capsules of a conductively doped resin-based material are created. A resin-based material is extruded/pultruded onto a bundle of conductive material. The resin-based material and the bundle are sectioned into moldable capsules.

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Patent Owner(s)

Patent OwnerAddress
INTEGRAL TECHNOLOGIES INC805 WEST ORCHARD DRIVE SUITE 3 BELLINGHAM WA 98225

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Zeidan, Mo Dearborn Heights, US 3 13

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