Cyclical physical vapor deposition of dielectric layers
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United States of America Patent
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Jun 9, 2015
Grant Date -
Sep 18, 2014
app pub date -
Mar 18, 2013
filing date -
Mar 18, 2013
priority date (Note) -
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Abstract
Embodiments include methods of forming dielectric layers. According to an exemplary embodiment, a dielectric layer may be formed by determining a desired thickness of the dielectric layer, forming a first dielectric sub-layer having a thickness less than the desired thickness by depositing a first metal layer above a substrate and oxidizing the first metal layer, and forming n (where n is greater than 1) additional dielectric sub-layers having a thickness less than the desired thickness above the first dielectric sub-layer by the same method of the first dielectric sub-layer so that a combined thickness of all dielectric sub-layers is approximately equal to the desired thickness.
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