HIGH-DENSITY MULTIDIRECTIONAL MIDPLANE
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Jun 28, 2013
filing date -
Mar 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A midplane may include a printed circuit board (PCB) with a top surface and a bottom surface. A first plurality of midplane connectors may be disposed on one or more edges of the top surface. The first midplane connectors may have one or more pins that are longitudinally oriented parallel to the top surface of the PCB. The midplane may further include a second plurality of midplane connectors disposed on the top surface. The second midplane connectors may have one or more pins that are longitudinally oriented perpendicular to the top surface of the PCB.
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