Interleaved heat sink and fan assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9409264
APP PUB NO 20140284030A1
SERIAL NO

13849725

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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According to embodiments of the invention, a structure for cooling electronic components may be provided. The structure may include a heat sink having a plurality of parallel heat conducting elements. The structure may also include a plurality of fans, wherein the fans are interleaved with the heat conducting elements. The structure may also include a drive shaft passing through the heat conducting elements and the fans, wherein the drive shaft rotates the fans in relation to the heat sink. According to other embodiments, the structure may include a baffle located on a side of the heat sink in an upstream location within an airflow stream.

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First Claim

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gilliland, Don A Rochester, US 70 294
Johnson, David B Seattle, US 74 1829
Mann, Phillip V Rochester, US 92 271

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