MINIMIZING PLATING STUB REFLECTIONS IN A CHIP PACKAGE USING CAPACITANCE
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United States of America Patent
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app pub date -
Jun 3, 2014
filing date -
Sep 25, 2008
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Abandoned
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Abstract
The present invention is directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a method including capacitively coupling a plating stub to ground so that the resonant frequency caused by the plating stub in a semiconductor package is shifted away from an operational frequency.
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