METHOD OF CUTTING A TEMPERED GLASS SUBSTRATE
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United States of America Patent
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app pub date -
Apr 3, 2012
filing date -
Dec 9, 2011
priority date (Note) -
Abandoned
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Abstract
A method of cutting a tempered glass substrate, which is capable of cut a tempered glass substrate without mechanical breaking process and cooling process , is disclosed. The method of cutting a tempered glass substrate, includes, forming an initial crack at a cut-starting point of the tempered glass substrate; forming a heated line at the tempered glass substrate by irradiating laser beam from a point different from the cut-starting point with the initial crack to the cut-starting point with the initial crack through optical heater; and automatically propagating the intimal crack along the heated line to cut the tempered glass substrate.
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