Connection Structure of Wiring Cable and Connection Method of Wiring Cable

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United States of America Patent

SERIAL NO

14179414

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Abstract

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To provide a connection structure of a wiring cable and a connection method of a wiring cable which enable the downsizing of a head part. The connection structure includes: a semiconductor chip having a plurality of imaging elements formed on a front surface and a plurality of connection pads formed on a rear surface; and a wiring cable in which a plurality of wires are integrally formed and from whose end surface the plural wires are exposed, wherein the plural connection pads of the semiconductor chip and the plural wires exposed from the end surface are connected.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA TOSHIBA1-1 SHIBAURA 1-CHOME MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kamei, Takatoshi Oueme-shi, JP 7 17

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