SEMICONDUCTOR DEVICE
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United States of America Patent
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N/A
Issued Date -
Sep 25, 2014
app pub date -
Sep 13, 2013
filing date -
Mar 22, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to one embodiment, a semiconductor device includes: a heat sink; a semiconductor element provided on a mounting surface of the heat sink; and a sealing body wrapping the heat sink and the semiconductor element, a thickness of a portion of the sealing body on a side of a surface on an opposite side to the mounting surface of the heat sink being smaller than a thickness of a portion of the sealing body on the mounting surface side of the heat sink. A first concave-convex is provided on the surface on an opposite side to the mounting surface of the heat sink. A second concave-convex larger than the first concave-convex is provided on a surface crossing the surface on an opposite side to the mounting surface of the heat sink.
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