Minimizing printed circuit board warpage

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10194537
APP PUB NO 20140285979A1
SERIAL NO

13849580

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed circuit board and method of manufacturing same, the printed circuit board comprising a stack of layers. The stack of layers being comprised of alternating circuit layers and insulating layers that are laminated together. The stack of layers includes an area with resin cured to a degree. The area has a coefficient of thermal expansion that is dependent, at least in part, on the degree of curing of the resin.

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First Claim

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chamberlin, Bruce J Vestal, US 47 293
Kuczynski, Joseph Rochester, US 573 2130
Nixa, Paula M Rochester, US 4 12

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