Thermal ground plane for cooling a computer

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United States of America Patent

PATENT NO 9377251
APP PUB NO 20140290909A1
SERIAL NO

14301623

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Abstract

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A method for cooling a computer uses thermal coupling for conveying heat from powered components of an electronic system. A fluid heat-exchanger is attached to the surface of the electronic system and filled with fluid coolant. A vacuum is applied between the heat-exchanger and the surface to seal the heat-exchanger to the electronic system. The fluid coolant is circulated through the heat-exchanger to convey heat from the fluid to an external cooling apparatus.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Martin, Yves Yorktown Heights, US 76 1170
Van, Kessel Theodore G Millbrook, US 182 1541

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