MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

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United States of America Patent

APP PUB NO 20140290997A1
SERIAL NO

14351763

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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To provide a multilayer wiring board that ensures sufficient adhesion between a resin insulating layer and a conductor layer and is excellent in connection reliability.

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Patent Owner(s)

Patent OwnerAddress
NGK SPARK PLUG CO LTDAICHI AICHI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maeda, Shinnosuke Nagoya-shi, JP 32 347

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