Importance

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Abstract

The present invention relates to a method of making a hybrid wiring board. In accordance with a preferred embodiment, the method includes: preparing a dielectric layer and a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier and the dielectric layer covers the supporting board; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; then mounting an interposer into the cavity; and then forming a build-up circuitry that includes a first conductive via in direct contact with the interposer and provides signal routing for the interposer. Accordingly, the direct electrical connection between the interposer and the build-up circuitry is advantageous to high I/O and high performance, and the stiffener can provide adequate mechanical support for the build-up circuitry and the interposer.

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First Claim