SPUTTERING APPARATUS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jun 13, 2014
filing date -
Dec 16, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sputtering apparatus includes a power application device configured to apply power to set a cathode body and a cathode magnet to an equipotential. The power to be applied to the cathode magnet is supplied via a spline arranged between the cathode body and a magnet rotating shaft attached to the cathode magnet.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully