ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

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United States of America Patent

APP PUB NO 20140292143A1
SERIAL NO

14217503

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Abstract

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The disclosure provides an electronic device that includes a substrate and a lid. The lid is bonded on the substrate to seal an inside of the lid using a resin. The lid includes a contact surface in contact with the resin. The contact surface includes a rough surface with an uneven shape.

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Patent Owner(s)

Patent OwnerAddress
NIHON DEMPA KOGYO CO LTDTOKYO 151-8569

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichikawa, Ryoichi Saitama, JP 42 288

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