Liquid ejecting head module and liquid ejecting apparatus
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United States of America Patent
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Mar 31, 2015
Grant Date -
Oct 2, 2014
app pub date -
Mar 24, 2014
filing date -
Mar 27, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A unit head has a head main body having a nozzle surface, and a substrate case having a fastening surface fastened to a fixation frame of a frame and accommodating a relay substrate. The fastening surface of a substrate case is formed at a position closer to a surface of an opposite side to a fixation frame than a side surface of a fastening surface side of the head main body, and the head main body is positioned further at an ink ejecting side than the fixation frame with the faster surface being fixed to the fixation frame, the other end of a first cable whose one end is connected to the electrode terminal of a piezoelectric element is connected to the relay substrate, a second cable connected to the relay substrate is drawn to an opposite side to a nozzle surface from a position close to a surface of an opposite side to the fastening surface, and the other end of the second cable is connected to a drive substrate.
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