WIRING BOARD
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United States of America Patent
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N/A
Issued Date -
Oct 2, 2014
app pub date -
Feb 21, 2014
filing date -
Mar 26, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A wiring board has a surface formed with a chip mounting area to which a chip component is mounted and includes embedded therein first and second multilayer capacitors, each of which has inner electrode layers laminated in a lamination direction. The first multilayer capacitors are embedded in a peripheral region of the wiring board immediately below a peripheral edge of the chip mounting area and a vicinity of the peripheral edge of the chip mounting area such that the lamination direction of the inner electrode layers of the first multilayer capacitors is perpendicular to the surface of the wiring board. The second multilayer capacitors are embedded in any other regions of the wiring board inside and outside the peripheral region such that the lamination direction of the inner electrode layers of at least one of the second multilayer capacitors is parallel to the surface of the wiring board.
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