METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING PLURAL SEMICONDUCTOR CHIPS STACKED ONE ANOTHER
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jun 11, 2014
filing date -
Nov 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed herein is a method of manufacturing a semiconductor device that includes stacking a plurality of semiconductor chips to form a first chip laminated body, providing an underfill material to fill gaps between the semiconductor chips so that a fillet portion is formed around the first chip laminated body, and trimming the fillet portion to form a second chip laminated body.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully