Build-up package for integrated circuit devices, and methods of making same
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United States of America Patent
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May 31, 2016
Grant Date -
Oct 2, 2014
app pub date -
Jun 17, 2014
filing date -
Jun 26, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A device is disclosed which includes, in one illustrative example, an integrated circuit die having an active surface and a molded body extending around a perimeter of the die, the molded body having lips that are positioned above a portion of the active surface of the die. Another illustrative example includes an integrated circuit die having an active surface, a molded body extending around a perimeter of the die and a CTE buffer material formed around at least a portion of the perimeter of the die adjacent the active surface of the die, wherein the CTE buffer material is positioned between a portion of the die and a portion of the molded body and wherein the CTE buffer material has a coefficient of thermal expansion that is intermediate a coefficient of thermal expansion for the die and a coefficient of thermal expansion for the molded body.
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