LIQUID COOLANT-SUBMERSIBLE NODE
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United States of America Patent
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N/A
Issued Date -
Oct 9, 2014
app pub date -
Apr 4, 2014
filing date -
Apr 4, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A node for performing computing operations includes a frame, a power supply coupled to the frame, and one or more liquid coolant-submersible motherboard assemblies. The one or more motherboard assemblies are configured to operate when submersed in a liquid coolant. The motherboard assemblies are mounted on the frame with one or more spaces between. The spaces form one or more channels between the motherboard assemblies. The frame includes an opening on at least one end of the one or more channels.
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