Composition for polishing purposes, polishing method using same, and method for producing substrate

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United States of America Patent

PATENT NO 9579769
APP PUB NO 20140302752A1
SERIAL NO

14352393

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Abstract

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Provided is a polishing composition, which comprises abrasive grains, a water-soluble polymer, an aggregation inhibitor and water. The ratio R1/R2 is 1.3 or less, where R1 represents the average particle diameter of the particles present in the polishing composition and R2 represents the average particle diameter of the abrasive grains when the abrasive grains are dispersed in water at the same concentration as that of the abrasive grains in the polishing composition. The polishing composition can be used mainly for polishing the surface of a silicon substrate.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Yoshio Kiyosu, JP 53 699
Takahashi, Shuhei Kiyosu, JP 60 304
Takami, Shinichiro Kiyosu, JP 19 54
Tsuchiya, Kohsuke Kiyosu, JP 35 84

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