POLISHING COMPOSITION
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United States of America Patent
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Issued Date -
Oct 9, 2014
app pub date -
Nov 6, 2012
filing date -
Nov 8, 2011
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Abstract
A polishing composition containing at least water and silica and satisfying all of the following conditions (a) through (d) is provided. Condition (a) The specific surface area of the silica contained in the polishing composition is 30 m2/g or more. Condition (b) Silica having a particle size of 10 to 50 nm is contained in the amount of 2% by mass or more. Condition (c) Silica having a particle size of 60 to 300 nm is contained in the amount of 2% by mass or more. Condition (d) The value obtained by dividing the average particle size of the silica specified in the condition (c) by the average particle size of the silica specified in the condition (b) is 2 or more.
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