METHOD OF FORMING REWORKABLE, THERMALLY CONDUCTIVE AND ELECTRICALLY RESISTIVE BONDING STRUCTURE IN SUPERCONDUCTOR MULTI-CHIP MODULE USING REWORKABLE EPOXY BONDING COMPOSITES AND APPLICATION OF THE SAME
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United States of America Patent
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Issued Date -
Oct 9, 2014
app pub date -
Jan 27, 2014
filing date -
Jan 25, 2013
priority date (Note) -
Abandoned
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Abstract
In one aspect, the present invention relates to a method of forming a reworkable, thermally conductive and electrically resistive material as a bonding structure in a module and application of the same. In certain embodiments, a homogeneous solution is prepared with an anisotropic structure, such as single-wall carbon nanotubes (SWCNTs), and an epoxy resin. The homogeneous solution is applied between a carrier and a chip of the module, and cured at a curing temperature for a curing time period to form a reworkable epoxy bonding layer, which has an anisotropic structure loading factor of about 0.1%-1.0% such that the reworkable epoxy bonding layer is thermally conductive and electrically resistive. When the chip is identified as a faulty chip, the module may be heated at a debonding temperature for a debonding time period such that the reworkable epoxy bonding layer debonds, and the chip becomes detachable from the carrier.
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