SILICON SUBSTRATE MEMS DEVICE
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United States of America Patent
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Issued Date -
Oct 16, 2014
app pub date -
Apr 11, 2013
filing date -
Apr 11, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A MEMS device includes a silicon substrate. The silicon substrate includes a plurality of dielectric material grooves spaced apart from each other. The silicon substrate also includes a through hole with a portion of the through hole being located between the plurality of dielectric material grooves when viewed from a direction perpendicular to a surface of the silicon substrate.
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