SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20140307365A1
SERIAL NO

13860602

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.

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Patent Owner(s)

Patent OwnerAddress
APAQ TECHNOLOGY CO LTDNO 11 KEYI ST NEIGHBORHOOD 11 GONGYI JHUNAN TOWNSHIP MIAOLI COUNTY 350

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, KUN-HUANG HSINCHU CITY, TW 20 50
CHIU, CHI-HAO HSINCHU CITY, TW 33 152
HUANG, CHUN-CHIA TAINAN COUNTY, TW 26 111
LIN, CHING-FENG HSINCHU COUNTY, TW 51 550

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