SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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app pub date -
Jun 17, 2014
filing date -
Jul 24, 2009
priority date (Note) -
Abandoned
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Abstract
According to one embodiment, coupling capacitance in a state in which a first heat radiation member is arranged between parallel flat plates of a first capacitor formed by a surface of a housing opposed to one surface of a printed circuit board and the printed circuit board is smaller than coupling capacitance in a state in which an integrally formed object having a relative dielectric constant of 5.8 is arranged between the first capacitor to cover a first radiating region containing the controller and the first nonvolatile semiconductor memories.
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