ENCAPSULATION FOR PHOTOVOLTAIC MODULE
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United States of America Patent
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Issued Date -
Oct 23, 2014
app pub date -
Sep 25, 2012
filing date -
Sep 26, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A photovoltaic module comprising a photovoltaic layer (2) with one or more photovoltaic cells and an encapsulation comprising a top foil (6). The photovoltaic layer (2) is provided with a texture layer (3), e.g. a front side metallization. The encapsulation further comprises a planarization layer (4) directly in contact with the photovoltaic layer (2) and texture layer (3). The planarization layer (4) levels all texture, enabling a top foil (6) being laminated with an adhesive to finalize the photovoltaic module.
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