PATTERN INSPECTION METHOD AND PATTERN INSPECTION APPARATUS
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United States of America Patent
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Issued Date -
Oct 23, 2014
app pub date -
Apr 16, 2014
filing date -
Apr 17, 2013
priority date (Note) -
Abandoned
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Abstract
A first differential image of a defect observation region including an observation target pattern is generated by a differential value between signals from electron detectors arranged in a direction of edges of the observation target pattern. A three-dimensional shape of a defect is obtained by subjecting the first differential image to integral process. Subsequently, a second differential image of a reference observation region, including a reference pattern having the same shape as the observation target pattern is generated by a differential value between signals from electron detectors arranged in a direction orthogonal to edges of the reference pattern. A three-dimensional shape of the reference pattern is obtained by subjecting the second differential image to the integral process. Then, a three-dimensional shape of the observation target pattern including the defect is obtained by combining the three-dimensional shapes of the defect and the reference pattern together.
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