COMPOSITION FOR BONDING
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United States of America Patent
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Issued Date -
Oct 23, 2014
app pub date -
Oct 9, 2012
filing date -
Oct 24, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is a composition for bonding, in particular, a composition for bonding which contains metal particles, said composition for bonding enabling the achievement of high bonding strength by bonding at a relatively low temperature and having such heat resistance that a decrease in the bonding strength does not easily occur due to &composition, deterioration or the like of a resin component when service temperature is increased. This composition for bonding is characterized by containing inorganic particles and an organic material that contains an amine and/or a carboxylic acid and adheres to at least a part of the surface of each inorganic particle, and is also characterized in that the weight loss rate when heated from room temperature to 200°c. is 33-69% and the weight loss rate when heated from 200° c. to 300° c. is 24-50% as determined by thermal analysis.
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