FinFET devices containing merged epitaxial Fin-containing contact regions

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United States of America Patent

PATENT NO 8900934
SERIAL NO

13865519

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Abstract

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A plurality of semiconductor fins are formed which extend from a semiconductor material portion that is present atop an insulator layer of a semiconductor-on-insulator substrate. A gate structure and adjacent gate spacers are formed that straddle each semiconductor fin. Portions of each semiconductor fin are left exposed. The exposed portions of the semiconductor fins are then merged by forming an epitaxial semiconductor material from an exposed semiconductor material portion that is not covered by the gate structure and gate spacers.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adam, Thomas N Slingerlands, US 146 2311
Basker, Veeraraghavan S Schenectady, US 487 4282
Li, Jinghong Poughquag, US 30 587
Lin, Chung-Hsun White Plains, US 170 2380
Naczas, Sebastian Albany, US 15 134
Reznicek, Alexander Troy, US 1408 11211
Yamashita, Tenko Schenectady, US 599 4981

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