PLASMA SOURCE AND VACUUM PLASMA PROCESSING APPARATUS PROVIDED WITH SAME
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United States of America Patent
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Oct 23, 2014
app pub date -
Nov 20, 2012
filing date -
Nov 22, 2011
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Abstract
A plasma source that is uniformly and efficiently cooled, a vacuum plasma processing apparatus including the plasma source, and a plasma source cooling method are provided. The vacuum plasma processing apparatus includes a vacuum chamber of which the inside is evacuated to a vacuum state and a plasma source which is provided inside the vacuum chamber. The plasma source includes a plasma generation electrode that generates plasma inside the vacuum chamber and a reduced pressure space forming member that forms a reduced pressure space accommodating a liquid cooling medium and depressurizing at the back surface of the plasma generation electrode, and the plasma generation electrode is cooled by the evaporation heat generated when the cooling medium is evaporated by a depressurization.
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