Method of processing a device substrate
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United States of America Patent
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Aug 4, 2015
Grant Date -
Oct 23, 2014
app pub date -
Jul 3, 2014
filing date -
Jul 16, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Methods of processing a device substrate are disclosed herein. In one embodiment, a method of processing a device substrate can include bonding a first surface of a device substrate to a carrier with a polymeric material. The device substrate may have a plurality of first openings extending from the first surface towards a second surface of the device substrate opposite from the first surface. Then, material can be removed at the second surface of the device substrate, wherein at least some of the first openings communicate with the second surface at least one of before or after performing the removal of the material. Then, at least a portion of the polymeric material disposed between the first surface and the carrier substrate can be exposed to a substance through at least some first openings to debond the device substrate from the carrier substrate.
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