Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method

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United States of America Patent

PATENT NO 9417228
APP PUB NO 20140316102A1
SERIAL NO

14256201

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Abstract

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A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATION3993 NIGORIKAWA KITA-KU NIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Enomoto, Toshiaki Niigata, JP 4 11
Hayashigaki, Arata Tokyo, JP 1 3
Hoshiyama, Masaaki Niigata, JP 8 10
Hotchi, Toyokazu Niigata, JP 7 11
Sato, Toshiyuki Niigata, JP 185 2463

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