Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure

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United States of America Patent

PATENT NO 10460945
APP PUB NO 20140318975A1
SERIAL NO

14358659

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Abstract

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The invention relates to a machine (1) adapted to metallize a cavity of a semi-conductive or conductive substrate such as a structure of the through silicon via type, according to a metallization process comprising the steps consisting of:

    a) depositing an insulating dielectric layer in the cavity,b) depositing a barrier layer to diffusion of the filling metal,c) filling the cavity by electrodeposition of metal, preferably copper, andd) carrying out annealing of the substrate,characterized in that it comprises a series of wet-processing modules (10-60) configured to conduct steps a), b) and c) by wet-processing in a chemical bath (B) and at least one additional module (70) adapted to conduct annealing step d) of the substrate (S) such that the machine (1) is capable of executing the entire metallization process of the cavity.

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Patent Owner(s)

  • ALCHIMER

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Raynal, Frederic Paris, FR 8 142

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