Resin Composition for Encapsulating Film of Photovoltaic Module and Photovoltaic Module Using the Same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 6, 2014
app pub date -
Oct 17, 2012
filing date -
Oct 18, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Provided are a resin composition for an encapsulating film of a photovoltaic module, and a photovoltaic module us ing the same, and more particularly, a resin composition for an encapsulating film of a photovoltaic module, having low moisture permeability and excellent adhesiveness due to thermal compression, and a photovoltaic module using the same, and thus, in the case where the resin composition for an encapsulating film of a photovoltaic module is used for a front sheet, a back sheet, or both of the front and back sheets, of a photovoltaic module, the resin composition can be used without an adhesive due to excellent transparency and durability against ultraviolet light and high adhesive strength with respect to glass, and thus can exhibit excellent compatibility.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully