Printed circuit boards fabricated using congruent molds

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9247649
APP PUB NO 20140326483A1
SERIAL NO

13887807

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Methods for fabricating printed circuit boards, devices for use in the fabrication of printed circuit boards, and structures for a printed circuit board. A mold may be formed as a device that includes a plurality of features, such as recesses, corresponding to a layout of a plurality of conductors for the printed circuit board. A sheet comprised of an electrically-conductive material may be deformed to match the features of the mold. A substrate may then be added to support the sheet, and the sheet may be selectively removed with a mechanical process to define the conductors of the printed circuit board.

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First Claim

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeVarney, Craig N Essex Junction, US 4 9

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