Land grid array interconnect formed with discrete pads

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9769924
APP PUB NO 20140326491A1
SERIAL NO

14323048

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Abstract

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A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.

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Patent Owner(s)

  • LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pymento, Larry G Cary, US 6 11
Sass, Tony C Fuquay Varina, US 25 155
Wormsbecher, Paul A Apex, US 41 436

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