ELECTROPLATING CONTACTS WITH SILVER-ALLOYS IN A BASIC BATH
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United States of America Patent
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Issued Date -
Nov 6, 2014
app pub date -
May 3, 2013
filing date -
May 3, 2013
priority date (Note) -
Abandoned
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Abstract
A method for silver-alloy plating an electrical contact and a silver-alloy plated electrical contact are provided. The method includes cleaning the electrical contact by removing contaminates and exposing the electrical contact to at least one of an acid or base. The method includes preparing a sliver-alloy plating bath including water, a silver complex, and a metal complex, the metal complex being at least one of nickel or cobalt. The method includes silver-alloy plating the electrical contact in the silver-alloy plating bath, wherein the plating bath has a pH of greater than 7. The metal complex forms about 0.3% to about 50% by weight of a content of a silver-alloy plated deposit.
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