Power transistor with heat dissipation and method therefore

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9129930
APP PUB NO 20140327124A1
SERIAL NO

14331724

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Abstract

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A device comprising a substrate, an integrated circuit (IC) die attached to the substrate on one side, a plurality of contact pads on an active side of the IC die, a plurality of thermally and electrically conductive legs, each of the legs attached to a respective one of the contact pads, and an encapsulating material formed around the substrate, the IC die, and a portion of the legs. A contact end of each of the legs is exposed, and one of the contact ends conducts a signal from a transistor in the IC die.

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Patent Owner(s)

  • NXP USA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Min Austin, US 80 982

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