Semiconductor device with embedded heat spreading
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United States of America Patent
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Jan 26, 2016
Grant Date -
Nov 6, 2014
app pub date -
Jul 15, 2014
filing date -
Apr 9, 2012
priority date (Note) -
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Abstract
A semiconductor device includes a semiconductor substrate and a plurality of clock drivers, wherein the plurality of clock drivers comprises substantially all clock drivers of the semiconductor device, and an interconnect region over the semiconductor substrate, wherein the interconnect region comprises a plurality of heat spreaders, wherein at least 25% of the plurality of clock drivers have a corresponding heat spreader of the plurality of heat spreaders. Each corresponding heat spreader of the plurality of heat spreaders covers at least 50% of a transistor within a corresponding clock driver of the plurality of clock drivers and extends across at least 70% of a perimeter of the transistor within the corresponding clock driver.
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